2017

Journals

  1. M. Fujishima, S. Amakawa, “Integrated-Circuit Approaches to THz Communications: Challenges, Advances, and Future Prospects,” IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences, vol. 100, no. 2, pp. 516-523, 2017/2/1
  2. T. A. Vu, M. Fujishima, “A 300 GHz CMOS Transmitter Front-End for Ultrahigh-Speed Wireless Communications,” International Journal of Electrical and Computer Engineering (IJECE), vol. 7, no. 4, 2017/8/1

International Conferences

  1. K. Takano, S. Amakawa, K. Katayama, S. Hara, R. Dong, A. Kasamatsu, I. Hosako, K. Mizuno, K. Takahashi, T. Yoshida, M. Fujishima, “17.9 A 105Gb/s 300GHz CMOS transmitter,” 2017 IEEE International Solid-State Circuits Conference (ISSCC), pp. 308-309, 2017/2/5
  2. A. Takeshige, K. Katayama, S. Amakawa, K. Takano, T. Yoshida, M. Fujishima, “DC and RF characterization of RF MOSFET embedding structure,” 2017 International Conference of Microelectronic Test Structures (ICMTS), pp. 1-5, 2017/3/27
  3. A. Takeshige, Y. Ito, K. Takano, K. Katayama, T. Yoshida, M. Fujishima, S. Amakawa, “Causal transmission line model incorporating frequency-dependent linear resistors,” 2017 IEEE 21st Workshop on Signal and Power Integrity (SPI), pp. 1-4, 2017/5/7
  4. K. Katayama, S. Amakawa, K. Takano, T. Yoshida, M. Fujishima, K. Hisamitsu, H. Takatsuka, “An 80–106 GHz CMOS amplifier with 0.5 V supply voltage,” 2017 Radio Frequency Integrated Circuits Symposium (RFIC), pp. 308-311, 2017/6/4
  5. Kyoya Takano, Kosuke Katayama, Shuhei Amakawa, Takeshi Yoshida, Minoru Fujishima, “56-Gbit/s 16-QAM Wireless Link With 300-GHz-Band CMOS Transmitter,” 2017 IEEE International Microwave Symposium (IMS2017), pp. 1-4 (7 June 2017)
  6.  Shinsuke Hara, Kosuke Katayama, Kyoya Takano, Ruibing Dong, Issei Watanabe, Norihiko Sekine, Akifumi Kasamatsu, Takeshi Yoshida, Shuhei Amakawa, Minoru Fujishima, “A 32 Gbit/s 16QAM CMOS Receiver in 300 GHz Band,” 2017 IEEE International Microwave Symposium (IMS2017), pp. 1-4 (8 June 2017)
  7. K. Takano, S. Amakawa, T. Yoshida, and M. Fujishima, “A figure of merit for terahertz transceiver modules,”Vietnam Japan Microwave 2017 Conference (VJMW 2017), 14 Jun 2017
  8. S. Kohara, S. Amakawa, T. Yoshida, M. Fujishima, “Noise-figure optimization of a multi-stage millimeter-wave amplifier with negative capacitance feedback,” 2017 Thailand-Japan Microwave (TJMW2017), 15 Jun 2017
  9. K. Katayama, K. Takano, S. Amakawa, T. Yoshida, M. Fujishima, “2.37-dBm-output 288–310 GHz frequency multiplier in 40 nm CMOS,” 2017 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT), pp. 28-30, 31 Aug 2017
  10. S. Hara, K. Katayama, K. Takano, R. Dong, I. Watanabe, N. Sekine, A. Kasamatsu, T. Yoshida, S. Amakawa, M. Fujishima, “A 416-mW 32-Gbit/s 300-GHz CMOS receiver” 2017 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT), pp. 65-67, 31 Aug 2017
  11. T. A. Vu, K. Takano, M. Fujishima, “A 300 GHz single varactor doubler in 40 nm CMOS,”  2017 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT), pp. 165-167, Sep 2017

Invited Talks and Tutorial Talks

  1. 藤島実, “究極の無線リンクを創る ―300GHz帯CMOSトランシーバーの挑戦―,” Wireless Technology Park 2017, 2017/5/26
  2. Minoru Fujishima, “300GHz wireless link with a CMOS transceiver,” Nano-Micro Conference 2017, June 20 2017
  3. Minoru Fujishima, “A 300GHz-band wireless transceiver using Si-CMOS integrated circuits,” Photonics Society Summer Topical Meeting Series (SUM), 2017 , pp. 167-168,  10 Jul. 2017
  4. R. Dong, K. Takano, K. Katayama, S. Hara , T. Yoshida, S. Amakawa,
  5. M. Fujishima, “300GHz CMOS Transceiver ―Beyond 5G Wireless ―,” 5G Event Shanghai, 20 July 2017
  6. M. Fujishima, R. Dong, “Ultimate high-speed and low-power CMOS transceiver,” Advanced CMOS Technology Summer School (ACSS) 2017, 1 Aug 2017
  7. M. Fujishima, “300-GHz-band CMOS wireless transceiver and its future,” 42 International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz 2017), 28 Aug 2017
  8. M. Fujishima, “Near-fiber-optic-speed 300-GHz-band link and a dedicated CMOS transceiver,” 2017 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT), pp. 59-61, 31 Aug 2017
  9. M. Fujishima, “Terahertz CMOS Transceiver for Tera-bps Wireless Link,” ASICON
  10. Fujishima, MTSA2017
  11. 高野恭弥、藤島実、MWE 2017
  12. Fujishima, IMaRC

Domestic Workshops

  1. 高野恭弥、”A 105Gb/s 300GHz CMOS Transmitter,” ISSCC報告会, 2017/2/17
  2. 高野恭弥、片山光亮、天川修平、吉田毅、藤島実 , “CMOSプロセスにおけるコプレーナ導波路の評価,” アナログRF研究会, 2017/3/1
  3. 片山 光亮、高野 恭弥、天川 修平、吉田 毅、藤島 実, “ミリ波回路設計のためのデバイスモデリング,” アナログRF研究会, 2017/3/1
  4. Tuan Anh Vu, Kyoya Takano, Kosuke Katayama, Rao Sasipalli and Minoru Fujishima, “Study on 300 GHz Varactor Doubler for Ultrahigh-Speed Wireless Communications,” アナログRF研究会, 2017/3/1
  5. V. Sasipalli, K. Katamaya, K. Takano, T. A. Vu, S. Amakawa, T. Yoshida, M. Fujishima, “Design of CMOS On-Chip Antenna in 300-GHz Band,” 電子情報通信学会技術研究報告= IEICE technical report: 信学技報, vol. 116, no. 487, pp. 95-100, 2017/3/2
  6. 高野恭弥, 天川修平, 片山光亮, 吉田毅, 藤島実, “テラヘルツ無線送受信モジュールの性能評価指標,” 電子情報通信学会技術研究報告= IEICE technical report: 信学技報, vol. 116, no. 487, pp. 19-22, 2017/3/2
  7. 片山光亮, 高野恭弥, 天川修平, 吉田毅, 藤島実, “高周波デバイスモデリングのためのシステマティックな等価回路生成法,” 電子情報通信学会技術研究報告= IEICE technical report: 信学技報, vol. 116, no. 486, pp. 23-27, 2017/3/2
  8. T. A. Vu, K. Takano, K. Katayama, V. Sasipalli, M. Fujishima, “Study on 300 GHz CMOS Doubler for Ultrahigh-Speed Wireless Communications,” 電子情報通信学会技術研究報告= IEICE technical report: 信学技報, vol. 116, no. 487, pp. 29-34, 2017/3/2
  9. 香原翔太, 天川修平, 吉田毅, 藤島実”ミリ波帯多段小信号増幅回路の雑音指数の最小化,” 電子情報通信学会総合大会, C-2-4, 2017/3/22