2018

Books

  1.  藤島実, “CMOS集積回路によるテラヘルツ通信とその応用,” ミリ波応用技術―アンテナ・回路・基板・材料―榊原久二男監修, 第2章 第1節, pp. 56-65

Journals

  1.  T. Vu, K. Takano, M. Fujishima, “Low-power D-band CMOS amplifier for ultrahigh-speed wireless communications,” International Journal of Electrical and Computer Engineering, vol. 8, no. 2, 1 Apr. 2018.
  2. T. Vu, K. Takano, M. Fujishima, “300-GHz Balanced Varactor Doubler in Silicon CMOS for Ultrahigh-Speed Wireless Communications,” IEEE Microwave Theory and Techniques Society, vol. 28, no. 4, pp. 341-343, April 2018
  3. 藤島実, “テラヘルツ通信で新しい応用を開くシリコン集積回路,” 電子情報通信学会誌, vol. 101, no. 6, pp. 554-560, June 2018
  4. S. Hara, K. Katayama, K. Takano, R. Dong, I. Watanabe, N Sekine, A. Kasamatsu, T. Yoshida, S. Amakawa,  and M. Fujishima, “32-Gbit/s CMOS receivers in 300GHz band,” IEICE Trans. Electron.,
    vol.E101-C, no.7, pp. 464-471, Jul. 2018.
  5. 藤島実, 天川修平, 高塚弘隆, “(招待論文) 低電圧電源ミリ波CMOS回路,” 電子情報通信学会論文誌 C, vol. J101-C, no. 9, pp. 362-369, Sep. 2018
  6. 通信ソサイエティマガジン 2018/x
  7. TST
International Conferences
  1. K. Takano, K. Katayama, S. Hara, R. Dong, K. Mizuno, K. Takahashi, A. Kasamatsu, T. Yoshida, S. Amakawa, M. Fujishima, “300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB,” The 2018 IEEE Radio and Wireless Symposium (RWS2018) , pp. 154-156, 16 Jan. 2018.
  2. S. Lee, K. Takano, R. Dong, S. Amakawa, T. Yoshida, M. Fujishima, “A 300-μW K-Band Oscillator with High-Q OpenStub
    Capacitor in 55-nm CMOS DDC,” TH2, The 2018 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT2018), Melborne, 16 Aug. 2018.
  3. R. Dong, K. Katayama, K. Takano, S. Lee, T. Yoshida, S. Amakawa, M. Fujishima, “A 79-85 GHz CMOS Amplifier with 0.35 V Supply Voltage,” 2018 13th European Microwave Integrated Circuits Conference (EuMIC), Madrid, 24 Sep. 2018.
  4. K. Takano, R. Dong, S. Lee, S. Amakawa, T. Yoshida, M. Fujishima, “A 239 – 315 GHz CMOS Frequency Doubler Designed by Using a Small-Signal Nonlinear Model,” 2018 13th European Microwave Integrated Circuits Conference (EuMIC), Madrid, 24 Sep. 2018
  5. S. Hara, K. Takano, K. Katayama, R. Dong, K. Mizuno, K. Takahashi, I. Watanabe, N. Sekine, A. Kasamatsu, T. Yoshida, S. Amakawa, M. Fujishima, “300-GHz CMOS Receiver Module with WR-3.4 Waveguide Interface,”  2018 48th European Microwave Conference (EuMC), Madrid, 26 Sep. 2018
  6. S. Lee, K. Takano, R. Dong, S. Amakawa, T. Yoshida, M. Fujishima, “A 37-GHz-Input Divide-by-36 Injection-Locked Frequency Divider with 1.6-GHz Lock Range,” IEEE Asian Solid-State Circuits Conference (A-SSCC 2018), Tainan, 7 Nov. 2018.

Invited and Tutorial Talks

  1. 藤島実, “300GHz帯無線通信用シリコンCMOS集積回路,” 電子情報通信学会総合大会, BCI-1-4, 東京, 2018/3/21.
  2. 藤島実, “シリコンCMOS集積回路を用いた300GHz帯通信とその応用,” 光ネットワークシステム技術第171委員会第64回研究会, 東京, 2018/5/28.
  3. M. Fujishima, “300-GHz CMOS wireless transceiver and its future,” WSD: eXtreme-bandwidth: architectures for RF and mmW transceivers in nanoscale CMOS, IEEE Radio Frequency Integrated Circuits Symposium (RFIC), Philadlphia, 10 June 2018.
  4. M. Fujishima, “Terahertz Wireless Communication with Silicon CMOS Integrated Circuits,” 2018 Thailand–Japan Microwave (TJMW), 28 June 2018
  5. M. Fujishima, “300-GHz-band CMOS wireless communication and its potential applications,” 2018 Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices (AWAD 2018), Kita-kyushu, 3 July 2018
  6. M. Fujishima, “300-GHz-band communication using silicon CMOS integrated circuits [Keynote],” 2018 Progress In Electromagnetic Research Symposium (PIERS 2018), Toyama, 4 Aug. 2018
  7. M. Fujishima, “Ultrahigh-speed terahertz wireless
    communication with silicon integrated circuits,” Workshop B, The 2018 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT2018), Melborne, 15 Aug. 2018.
  8. M. Fujishima, “300GHz-Band CMOS Wireless Transceiver,” FR4, The 2018 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT2018), Melborne, 17 Aug. 2018.
  9. M. Fujishima, “300-GHz-band wireless transceiver with CMOS integrated circuits,” 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT-2018), Qingdao, 1 Nov. 2018.
  10. M. Fujishima, “Terahertz CMOS technology for beyond 5G,” IEEE Asian Solid-State Circuits Conference (A-SSCC 2018), Tainan, 5 Nov. 2018.
  11. S. Hara, K. Takano, K. Katayama, R. Dong and S. Lee, I. Watanabe, N. Sekine, A. Kasamatsu, T. Yoshida, S. Amakawa and M. Fujishima, “300-GHz CMOS transceiver for terahertz wireless communication,” 30th Asia-Pacific Microwave Conference (APMC 2018) , Kyoto, 8 Nov. 2018.
  12. CIRFE 2018/12
  13. URSI-C研究会 2018/12

Domestic Workshops

  1. 香原翔太, 董鋭冰, 天川修平, 吉田毅, 藤島実, “2種類の局所帰還を用いたW帯CMOS増幅器の低雑音化,” 電子情報通信学会総合大会,C-12-8, 2018/3/20.
  2. 竹川響弥, 董鋭冰, 高野恭弥, 天川修平, 吉田毅, 藤島実, “0.5V動作73-78GHz帯CMOS低雑音増幅器,” 電子情報通信学会総合大会,C-12-9, 2018/3/20.
  3. 瀧脇朋也, 藤島実, 吉田毅, 天川修平, 高野恭弥, 李尚曄, “60GHz帯低電圧低消費電力LC電圧制御発振器,” 電子情報通信学会総合大会,C-12-26, 2018/3/21