電子デバイス工学研究室
広島大学工学部第二類，電子システムプログラム所属の研究室です．
研究分野
- マイクロ波，ミリ波工学
- 集積回路
- 回路理論
- デバイスモデリング
構成員（2024年4月1日現在）
- 教授：天川修平
- B4：2名
研究室メンバーによる最近の発表
- S. Amakawa, T. Yoshida, M. E. Gadringer, and W. Bösch, "Modal TRL de-embedding of symmetric differential transmission lines with proper reference impedance matrix transformations," 104th ARFTG Microwave Measurement Symposium, San Juan, Puerto Rico, January 21, 2025.
- S. Amakawa, S. Tanaka, M. Fujishima, and T. Yoshida, "Second-tier TRL-based characteristic impedance estimation using a longer thru," Asia-Pacific Microwave Conference, pp. 971–973, Bali, Indonesia, November 20, 2024.
- 三橋樹，天川修平， 「Polyharmonic distortion modelによる非線形回路網の解析」， 電子情報通信学会マイクロ波研究会， MW2024-126, 2024年11月14日．
- S. Amakawa, "Measurement and modeling for sub-THz CMOS design: Challenges and opportunities," Asia-Pacific Microwave Conference, pp. 864–866, Taipei, Taiwan, December 8, 2023.
- S. Amakawa, "X-parameters and metrology applications," Workshop on Advanced Techniques and Applications for Large Signal Measurements and Characterization, Asia-Pacific Microwave Conference, Taipei, Taiwan, December 5, 2023.
- S. Amakawa, "On-chip transmission lines for silicon CMOS 6G: From basics to open questions," Tutorial talk, 2023 International Conference on IC Design and Technology, Tokyo, Japan, September 25, 2023.
- S. Amakawa, "Design of silicon CMOS ICs and modules for 6G: With headaches, possible cures, and open questions in measurements," 100th ARFTG Microwave Measurement Conference, Workshop on Emerging millimeter-wave & THz measurement for 6G communication, Las Vegas, Nevada, USA, January 25, 2023.
- 上村莉久，天川修平，「伝送線路を構成する導体のモデルパラメータの 抽出」，ICD/CAS学生若手研究会，発表番号42，2022年12月17日．
- 天川修平， 「ミリ波オンウェハー測定：暗部と光明」， Microwave Workshops & Exhibition (MWE)， ワークショップ FR1B，November 26, 2021.
- K. Ono and S. Amakawa, "Theoretical study of optimal feedback LNA design," IEEE International Symposium on Radio-Frequency Integration Technology (RFIT), pp. 201–203, September 4, 2020.
- S. Amakawa, "Sub-THz CMOS transmission lines: Properties, characterization, and modeling," IEEE International Symposium on Radio-Frequency Integration Technology (RFIT), p. 64, September 2, 2020.
- S. Amakawa and M. Fujishima, "Wideband power-line decoupling technique for millimeter-wave CMOS integrated circuits," IEEE International Symposium on Circuits and Systems (ISCAS), pp. 1–4, May 29, 2019.
- S. Amakawa, "Characteristic impedance determination up to THz frequencies in light of causality," Global Symposium on Millimeter Waves (GSMM), pp. 50–52, May 23, 2019.
- S. Amakawa, A. Takeshige, S. Hara, R. Dong, S. Lee, T. Yoshida, M. Fujishima, K. Masu, and H. Ito, "Causal characteristic impedance determination using calibration comparison and propagation constant," 92nd ARFTG Microwave Measurement Conference, Orlando, Florida, USA, January 22, 2019.
- S. Amakawa, "Feedback network design for transistor operating near its performance limit," Emerging Technologies 2018 (ETCMOS), Whistler, Canada, May 10, 2018.
- S. Amakawa, "How does my microwave/EM simulator define complex-referenced S-parameters?," Vietnam-Japan Microwave (VJMW), pp. 112–115, Hanoi, Vietnam, June 14, 2017.
- K. Katayama, S. Amakawa, K. Takano, T. Yoshida, M. Fujishima, K. Hisamitsu, and H. Takatsuka, "An 80–106 GHz CMOS amplifier with 0.5 V supply voltage," IEEE Radio Frequency Integrated Circuits Symposium (RFIC), pp. 308–311, Honolulu, Hawaii, USA, June 6, 2017.
- Y. Kobayashi and S. Amakawa, "Prescriptions for identifying the definition of complex-referenced S-parameters in commercial EM simulators," 38th Progress in Electromagnetics Symposium (PIERS) in St Petersburg, Abstracts pp. 264–265, St Petersburg, Russia, May 22, 2017.
- A. Takeshige, Y. Ito, K. Takano, K. Katayama, T. Yoshida, M. Fujishima, and S. Amakawa, "Causal transmission line model incorporating frequency-dependent linear resistors," 21st IEEE Workshop on Signal and Power Integrity (SPI), pp. 1–4, Baveno, Italy, May 8, 2017.
- A. Takeshige, K. Katayama, S. Amakawa, K. Takano, T. Yoshida, and M. Fujishima, "DC and RF characterization of RF MOSFET embedding structure," International Conference on Microelectronic Test Structures (ICMTS), pp. 103–107, Grenoble, France, March 29, 2017.